Method and apparatus for minimally-invasive implantation of electrodes and flexible, thin-film substrates into cortical or sub-cortical structures of the brain
US10967172B1 · kind B1 · utility
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26Claims
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Key dates
| Filing date | Dec 27, 2018 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Feb 19, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B90/11
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An apparatus for implanting electrodes in neural tissue to connect a neural modulator to the tissue to send and receive signals from the neural tissue and a method for implanting the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.