Coated copper particles and use thereof
US10967428B2 · kind B2 · utility
1Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2015 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Mar 1, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein are coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Further disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper particles, and optional (c) solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.