Mold, system and method for manufacturing a molded part
US10967547B2 · kind B2 · utility
0Cited by
21References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 21, 2015 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3008
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold, system and method for manufacturing a part includes injection molding a substrate in a single injection mold and optionally trimming the panel substrate. The substrate can have a first configuration or a second, different configuration. Trimming of the substrate can occur when the substrate has the first configuration to define an aperture in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.