Fabrication of metallic optical metasurfaces
US10968522B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2018 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Mar 23, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03H2260/62
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The disclosure provides a method for fabricating a metallic optical metasurface having an array of hologram elements. The method includes forming a first copper layer protected with a conducting or dielectric barrier layer over a backplane structure by a damascene process. The first copper layer comprises a plurality of nano-gaps vertically extending from the backplane structure. The plurality of nano-gaps is filled with a dielectric material. The method also includes removing the dielectric material and a portion of the conducting or dielectric barrier layer to expose the portions in the nano-gaps of the first copper layer. The method may further include depositing a dielectric coating layer over the top portion and exposed side portions of the first copper layer to form a protected first copper layer, and filling the gaps with an electrically-tunable dielectric material that has an electrically-tunable refractive index.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.