Heat sink and electronic device having same
US10969837B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2019 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Nov 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/467
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A loop thermosiphon (LTS) heat sink includes an evaporator, a condenser, a gas conduit, and a liquid conduit. The evaporator includes a first surface, a second surface opposite to the first surface, and a third surface coupled between the first surface and the second surface. Each of the first surface and the second surface is configured to mount a heat generating component. One end of the gas conduit is coupled to one end of the liquid conduit, and another end of the gas conduit and another end of the liquid conduit are coupled to the evaporator through the third surface. The evaporator, the gas conduit, and the liquid conduit cooperatively form a circulation passage. A connecting portion of the gas conduit and the liquid conduit is received within the condenser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.