Multilayer electronic component
US10971303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2017 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Jul 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes first and second external electrodes disposed on one surface of the body, the first internal electrode and the first external electrode being connected by a first via disposed within the body, the second internal electrode and the second external electrode being connected by a second via disposed within the body, the first internal electrode including first and second through portions, and the second internal electrode including third and fourth through portions, the first via penetrating alternately through the first through portion and the third through portion, the second via penetrating alternately through the second through portion and the fourth through portion, and a lead portion of the first via being connected to one end portion of the first external electrode, and a lead portion of the second via being connected to one end portion of the second external electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.