Metal nanowire based thermal interface materials
US10971423B2 · kind B2 · utility
2Cited by
2References
15Claims
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Key dates
| Filing date | Jun 10, 2019 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Jul 15, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2255/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high-performance thermal interface material comprising a heterogeneous copper-tin nanowire array that is ultra-compliant and that can reduce thermal resistance by two times as compared with the state-of-the-art thermal interface materials. The high-performance thermal interface material can be further used in electronic systems, ranging from microelectronics to portable electronics to massive data centers, to operate at lower temperatures, or at the same temperature but with higher performance and higher power density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.