High frequency module and communication device
US10971466B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2019 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Dec 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.