Detector architecture using photodetector arrays on thinned substrates
US10971541B2 · kind B2 · utility
2Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Dec 21, 2017 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Dec 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.