Capacitive electronic chip component
US10971578B2 · kind B2 · utility
1Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2019 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Oct 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02255
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure concerns a capacitive component including a trench and, vertically in line with the trench, first portions of a first silicon oxide layer and first portions of second and third conductive layers including polysilicon or amorphous silicon, the first portion of the first layer being between and in contact with the first portions of the second and third layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.