Indium-based interface structures, apparatus, and methods for forming the same
US10973114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2018 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Oct 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20481
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.