Heat dissipation plate assembly, display module and its assembling method
US10973155B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 19, 2020 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Jun 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20963
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A display substrate includes a first region, a second region, and a bendable region between the first region and the second region, and a heat dissipation plate assembly for heat dissipation of the display substrate includes: a first release film; a heat dissipation plate, comprising a first portion and a second portion which are separated by a space and located on the first release film; a protective film, located on a side of the heat dissipation plate distal to the first release film, having a substantially same shape as the heat dissipation plate, and comprising a third portion located on the first portion and a fourth portion located on the second portion, the third portion being able to be bonded to the first region of the display substrate, and the fourth portion being able to be bonded to the second region of the display substrate; and a second release film, located on a side of the protective film distal to the heat dissipation plate and having a substantially same shape as the first release film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.