Apparatus and method for mounting components on a substrate
US10973158B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2018 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Nov 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.