Patent · US Active

Reconstruction of surfaces for additive manufacturing

US10974460B2 · kind B2 · utility

2Cited by
7References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 8, 2020
Grant dateApr 13, 2021
Priority date
Expiry dateJan 8, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B2219/49023
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

Tracking of measured depth with intervening depositing of one or more layers provides a way of improving the accuracy of surface reconstruction. For example, knowledge of the desired or expected thickness of each layer, in combination with the scan data is combined to yield higher accuracy than is available from scan data of a single scan alone. One application of such an accurate surface reconstruction is in a feedback arrangement in which the desired thickness of one or more subsequent layers to be deposited after scanning is determined from the estimate of the surface depth and a model of the object that is being fabricated, and by increasing accuracy of the surface depth estimate, the precision of the fabrication of the object may be increased.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.