Curable formulations for laminating adhesives
US10975192B2 · kind B2 · utility
0Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2015 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Dec 17, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J167/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a) a blend comprising i) an epoxy terminated polyester and at least one of ii) a maleate (poly) ester or iii) a diacrylate terminated oligomer or polymer and b) an aliphatic amine curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.