Thermal flow measuring device including probe having probe core with hard solder

US10976188B2 · kind B2 · utility

Assignee

• Endress+Hauser Flowtec AG · CH

Inventors

• Stephan Gaberthüel · Oberwil, CH
• Alexander Grün · Lörrach, DE
• Hanno Schultheis · Hermrigen, CH
• Tobias Baur · Reinach, CH
• Martin Barth · Munich, DE
• Anastasios Badarlis · Birsfelden, CH
• Lars Neyerlin · Wahlen, CH
• Martin Arnold · Cambridge, GB
• Oliver Popp · Hirschaid, DE

Key dates

• Filing date: Oct 10, 2017
• Grant date: Apr 13, 2021
• Expiry date: Nov 14, 2037

Classification

• Technology area (CPC G): Physics
• CPC primary: G01F15/00
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The present disclosure relates to a method for manufacturing a probe of a thermal, flow measuring device for measuring mass flow of a liquid in a measuring tube, wherein the method includes: introducing a probe core including a hard solder and a core element into a first probe sleeve, wherein the first probe sleeve has an open first end and a closed second end away from the first end; melting the hard solder; affixing the core element by cooling the hard solder to a temperature less than the solidification temperature; and applying a thermoelement to a contact area of the core element or of the solidified hard solder. The present disclosure relates, furthermore, to a probe resulting from the manufacturing process as well as to a flow measuring device having at least one probe of the-present disclosure.