Dynamic quantity measuring apparatus having a strain sensor disposed in a groove
US10976205B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2016 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Nov 23, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0055
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A dynamic quantity measuring apparatus includes a strain sensor, a resin member, a strain body, and a boding portion. The strain sensor has a plurality of piezoresistance elements and a plurality of electrode pads formed on a surface of a semiconductor substrate. The resin member for electrical wiring is provided with a plurality of wires electrically connected to the plurality of electrode pads. The strain body is joined to a back surface of the strain sensor. The bonding portion is configured to bond the resin member for electrical wiring to the strain body. A groove is provided in a region of the resin member for electrical wiring located in a vicinity of the strain sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.