Silicon photonic package structure
US10976488B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2020 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Mar 4, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12152
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A silicon photonic package structure including a substrate, a conductive bump, an obstacle structure, a laser diode, a mode converter, and a ball lens is provided. The conductive bump is disposed on the substrate. The obstacle structure is formed on the substrate. The laser diode is disposed above the substrate and electrically bonded to the conductive bump. A surface of the laser diode facing the substrate has a ridge. An end of the ridge has a light-emitting surface. The obstacle structure is located between the conductive bump and the ridge. A thickness of the obstacle structure in a direction perpendicular to the surface of the substrate is greater than a thickness of the ridge in the direction perpendicular to the surface of the substrate. The mode converter is formed on the substrate. The ball lens is formed on the substrate and located between the light-emitting surface and a light input end of the mode converter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.