Patent · US Active

Packaging of vertically oriented orthogonally connected systems

US10976785B1 · kind B1 · utility

1Cited by
2References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 25, 2020
Grant dateApr 13, 2021
Priority date
Expiry dateMar 25, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K7/1461
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A computing system including a chassis and a canister slidably insertable within the chassis, where the canister includes first and second angled slots. A CPU module mounted within the canister includes a plurality of first connectors and a plurality of I/O modules are positioned within the chassis and include a second connector. A plurality of riser cards including a third connector coupled to a bottom edge and a fourth connector coupled to a rear edge, where the third connector on each riser card is connected to one of the first connectors and the fourth connector on each riser card is connected to one of the second connectors. Actuation of ejector levers pivotally mounted to the bottom panel of the chassis cause pins to move in the angled slots and the canister to move relative to the chassis so as to connect and disconnect the second and fourth connectors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.