Method for generating packing solution of printed circuit board
US10977411B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 15, 2020 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Jul 15, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for generating packing solution of printed circuit board (PCB) comprises: obtaining a plurality of component files, a first constraint, and a second constraint, wherein each of the component files corresponds to an electrical component, the first constraint corresponds to a signal-PCB, and the second constraint corresponds to a multiple-PCB; performing a genetic algorithm according to the plurality of component files and the first constraint files to generate a plurality of single-PCB feasible solutions, wherein each of the plurality of single-PCB feasible solutions has a shape description, performing a concave hull algorithm to update the shape description according to each of the plurality of single-PCB feasible solutions, after updating the shape description, performing the genetic algorithm according to the plurality of single-PCB feasible solutions and the second constraint to generate a multiple-PCB packing solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.