Vacuum suction apparatus
US10978332B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2017 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Jul 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vacuum suction apparatus includes a semiconductor substrate with a top portion having grooves and a bottom portion having through holes, wherein each said groove correspondingly connects with at least one said through hole, and the groove has a width greater than a width of the through hole; and a cover plate disposed on a top surface of the semiconductor substrate. At least one edge of the vacuum suction apparatus has a vacuum chamber, which connects with the grooves. In another embodiment, the cover plate is replaced with a vacuum cover disposed above the semiconductor substrate, wherein the vacuum cover and the semiconductor substrate construct a vacuum chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.