Conductive vias
US10978400B2 · kind B2 · utility
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20Claims
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Assignee
Inventor
Key dates
| Filing date | Apr 22, 2019 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure concerns a semiconductor chip, which may be an interposer, having conductive through vias having a parallelepipedal shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.