Patent · US Active

Sensor

US10978597B2 · kind B2 · utility

0Cited by
3References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 5, 2017
Grant dateApr 13, 2021
Priority date
Expiry dateDec 21, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/855
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.