Sensor
US10978597B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2017 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Dec 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.