Patent · US Active

Cooling of power electronics circuits

US10980103B2 · kind B2 · utility

27Cited by

3References

18Claims

0Family size

Assignee

Dr. Ing. h.c. F. Porsche AG · DE

Inventors

Stefan Götz · Forstern, DE
Eduard Specht · Dormagen, DE

Key dates

Filing date	Mar 27, 2019
Grant date	Apr 13, 2021
Priority date	—
Expiry date	Apr 26, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10522
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for cooling power electronics circuits, in which a printed circuit board is produced according to a prescribed circuit board process and is populated with at least one power electronics components. Contact connecting at least one location on at least one metallic conductor track running on a surface of the printed circuit board that includes at least one metal element, which is both electrically conductive and heat-conductive and the physical height of which is designed to be at least as large as that of the at least one power electronics component. A cooling plate is placed in a planar manner onto the at least one power electronics component and/or the at least one metal element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.