Multilayer electronic component and board having the same
US10980124B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2019 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Jul 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2045
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1≤G/CT≤0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.