Insulated socket body and terminals for a land grid array socket assembly
US10980135B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Aug 12, 2020 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Aug 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10833
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An insulated socket body and terminal assembly for an integrated chip includes upper and lower insulated socket body portions which are received together in mated relation to define a socket body having a plurality of lumens extending therethrough. The assembly further includes a like plurality of monolithic spring terminals received within the lumens, wherein the spring terminals include upper and lower contact ends connected by a central cantilever spring. The central cantilever springs are received within central recess portions of the lumens and the upper and lower contact ends are received in respective upper and lower guide portions of the lumens and project outwardly from respective upper and lower surfaces of the upper and lower insulated socket body portions. The central recess portions of the lumens are configured to retain the cantilever springs in a first uncompressed configuration and in a second compressed configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.