Multi-layered printed circuit board
US10980136B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2017 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Apr 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a multi-layered printed circuit board (PCB) may include, with a printing device, delivering a flexible medium to at least one fluid jet printhead. Printing an electrically conductive fluid on the flexible medium may be performed with at least one fluid jet printhead, to form a first conductive layer on the flexible medium. With the at least one fluid jet printhead, an electrically insulating fluid may be printed on the first conductive layer to form at least one insulating layer on the first conductive layer. With the at least one fluid jet printhead, the electrically conductive fluid may be printed on the at least one insulating layer to form a second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.