Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compound
US10981865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2017 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Jan 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/145
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.