Patent · US Active

Adhesive and damping film

US10982116B2 · kind B2 · utility

0Cited by
5References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 24, 2017
Grant dateApr 20, 2021
Priority date
Expiry dateJun 18, 2037

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2467/00
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between −40° C. and −10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.