Adhesive and damping film
US10982116B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2017 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Jun 18, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2467/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between −40° C. and −10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.