Homogeneous linear evaporation source
US10982319B2 · kind B2 · utility
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46References
20Claims
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Assignee
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Key dates
| Filing date | Aug 19, 2016 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Oct 3, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates and more particularly for controlled coating of large substrates, such as vacuum deposition of copper, indium, gallium, selenium, tellurium, cadmium, or zinc on flexible substrates. Embodiments disclosed herein are able to control the evaporation rate of the source material during processing so as to obtain a uniform deposition across the width of the substrate as the complete length of a roll-to-roll substrate is moved past the evaporation source during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.