Patent · US Active

Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

US10982343B2 · kind B2 · utility

0Cited by

10References

17Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Philipp Wachter · Berlin, DE
Christina Pfirrmann · Berlin, DE
Stefan Kretschmer · Berlin, DE

Key dates

Filing date	Oct 16, 2018
Grant date	Apr 20, 2021
Priority date	—
Expiry date	Oct 16, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09B17/02
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present invention relates to a plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least one phenazine dye and at least one ethanediamine derivative. The present invention further concerns the use of above plating composition and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.