Tin-plated product and method for producing same
US10982345B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 18, 2017 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Oct 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.