Systems, methods, and apparatuses for in machine profiling of a laser beam

US10982998B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Thomas Hackert · Germering, DE
• Tobias Christian Roeder · Munich, DE
• Uwe Stute · Wunstorf, DE

Key dates

• Filing date: Aug 9, 2019
• Grant date: Apr 20, 2021
• Expiry date: Aug 9, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G01J2001/4261
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.