Thermopile module
US10983009B2 · kind B2 · utility
2Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2020 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Jun 19, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.