Transfer-printed near-field transducer and heat sink
US10984821B1 · kind B1 · utility
4Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Oct 25, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A near-field transducer or heat sink is formed via a first process. The near-field transducer or heat sink is transfer-printed to a read/write head via a second process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.