Resin molded substrate and mounting structure for capacitor
US10984949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2020 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Mar 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.