Method of forming an apparatus comprising perovskite
US10985319B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jun 14, 2017 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method comprising: providing a substrate comprising one or more electronic structures; providing a layer of perovskite overlaying the one or more electronic structures; coating a layer of photoresist material overlaying the layer of perovskite; aligning a mask with the one or more electronic structures and patterning the photoresist material; and using the same etchant to remove sections of the patterned photoresist material and the perovskite underneath the sections of the photoresist material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.