Module structures and flexible display devices
US10985334B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A module structure includes a support film layer. The support film layer includes a film layer body and a stress relief gap disposed in the film layer body. The stress relief gap includes a layer gap, and the film layer body is divided into stacked sub-layers by the layer gap. In the module structure according to the embodiments of the present application, the stress relief gap is disposed in the film layer body of the support film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.