Antenna packaging structure
US10985443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2019 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Jul 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/0407
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna packaging structure includes a top substrate, an antenna chip, a bottom substrate, and a plurality of antenna transmission lines. The top substrate includes an antenna. The bottom substrate includes a circuit. The antenna chip is mounted on the bottom substrate, and is electrically connected to the antenna of the top substrate through the circuit of the bottom substrate and the antenna transmission lines. Since the antenna chip is directly electrically connected to a processor through the circuit, a plurality of communication lines do not need to be electrically connected between the antenna and the circuit. Further, since the antenna transmission lines just need to transmit a simple antenna signal between the antenna and the antenna chip, an amount of the antenna transmission lines is smaller than an amount of communication lines. Moreover, the total size of the antenna packaging structure is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.