High performance heat sink for double sided printed circuit boards
US10986722B1 · kind B1 · utility
0Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2019 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Nov 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8583
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for transferring heat from printed circuit boards (PCBs) with light emitting diodes (LEDs) includes a PCB having a first side and a second side and configured to be coupled to an exterior portion of an aircraft. The system further includes a LED located on the first side of the PCB. The system further includes a first metal strip located on the second side of the PCB. The system further includes a heat sink configured to contact the first metal strip to dissipate heat from the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.