Flexible circuit board for all-in-one chip on film, chip package including same, and electronic device including same
US10986726B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2018 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | May 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.