Patent · US Active

Method of manufacturing a holding plate, in particular for a clamp for holding wafers

US10987760B2 · kind B2 · utility

0Cited by

5References

17Claims

0Family size

Assignee

BERLINER GLAS KGAA HERBERT KUBATZ GMBH & CO. · DE

Inventors

Ralf Hammer · Freiberg, DE
Stefan Hoescheler · Munich, DE
Mike Fischer · Berlin, DE
Gregor Hasper · Berlin, DE

Key dates

Filing date	May 25, 2016
Grant date	Apr 27, 2021
Priority date	—
Expiry date	Feb 10, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/52
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Method of manufacturing holding plate (11) including ceramic material of several chemical elements and configured for holding apparatus (10) for holding a component by electrostatic forces or vacuum, includes the steps of material removal from holding plate (11) by laser ablation, wherein by laser irradiation (1) protrusions (13) are formed on holding plate (11), end faces (13.1) of which span a carrier surface for the component, and surface modification of holding plate (11) by laser irradiation (1), wherein irradiation parameters of laser irradiation (1) are set such that at least one of the chemical elements of the ceramic material is enriched on the surface of holding plate (11). A method is also described of manufacturing holding apparatus (10) for holding a component by electrostatic forces or vacuum, holding plate (11) which is produced with the inventive method, and holding apparatus (10) with at least one holding plate (11).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.