Methods and systems for electroadhesion-based manipulation and mechanical release in manufacturing
US10987815B2 · kind B2 · utility
0Cited by
15References
20Claims
0Family size
Assignee
Inventors
- Harsha Prahlad
- Richard J. Casler
- Susan Kim
- Matthew Leettola
- Jon Smith
- Kenneth Chong Yin Tan
- Patrick Wang
- John Mathew Farren
- Patrick Conall Regan
- Po-Cheng Chen
- Howard Fu
- Honam Ko
- Dragan Jurkovic
- Aishwarya Varadhan
- Tsung Tai Chien
- Chang-Chu Liao
- Chih-Chi Chang
- Kuo-Hung Lee
- Ming-Feng Jean
- TaeHoun Kim
- Qingde Chen
- Greg Miller
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Jan 1, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2309/70
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively. The mechanically actuated modality in one embodiment is configured as a netting configured to be placed over a contact surface of an electroadhesive plate to facilitate the handling of an object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.