Packaging structure
US10988278B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2018 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Jan 17, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D85/42
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A packaging structure for electronic expansion valves includes a body for accommodating the electronic expansion valves, wherein the body includes more than one supporting portion, each supporting portion has first recess portions and second recess portions alternately arranged, the first recess portions and the second recess portions are all configured to support housings of the electronic expansion valves; and a center distance of each of the first recess portions and the adjacent second recess portion is the same as an outer diameter of the housing of each of the electronic expansion valves, to allow the housings of two of the electronic expansion valves to be attached together after the two electronic expansion valves are placed in an opposite direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.