Patent · US Active

Copper-ceramic substrate, copper precursor for producing a copper-ceramic substrate and process for producing a copper-ceramic substrate

US10988418B2 · kind B2 · utility

0Cited by

16References

10Claims

0Family size

Assignee

AURUBIS STOLBERG GMBH & CO. KG · DE

Inventors

KARL ZEIGER · Eschweiler, DE
BENJAMIN CAPPI · Neu-Moresnet, BE
HELGE LEHMANN · Nideggen, DE
Robert Koch · West Jordan, US

Key dates

Filing date	Dec 6, 2016
Grant date	Apr 27, 2021
Priority date	—
Expiry date	Jul 6, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/86
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.