Resin composition
US10988656B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2018 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Jul 3, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/016
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive resin composition is disclosed herein. The thermally conductive resin composition exhibits high thermal conductivity while having excellent handling properties. In an embodiment, a resin composition includes a resin component and 600 parts by weight or more of a thermally conductive filler relative to 100 parts by weight of the resin component. The thermally conductive filler comprise 30 to 50 wt % of a first thermally conductive filler having a D50 particle diameter of 35 μm or more, 25 to 45 wt % of a second thermally conductive filler having a D50 particle diameter in a range of 15 μm to 30 μm, and 15 to 35 wt % of a third thermally conductive filler having a D50 particle diameter of 1 to 4 μm, based on the total weight of the thermally conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.