Sensor package

US10989571B2 · kind B2 · utility

Assignee

• Sensirion AG · CH

Inventors

• Werner Hunziker · Männedorf, CH
• David Pustan · Zürich, CH
• Matthias Boeller · Männedorf, CH
• Stephan Braun · Kehlhof, CH

Key dates

• Filing date: Apr 24, 2018
• Grant date: Apr 27, 2021
• Expiry date: Apr 24, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N33/0036
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A sensor package comprises a sensor chip (3) with a sensitive element (31) exposed to an environment of the sensor package, and contact pads (2) for electrically contacting the sensor package. Electrical connections (5) are applied between the sensor chip (3) and the contact pads (2). A molding compound (1) at least partially encloses the sensor chip (3) and the contact pads (2). A unit (3, 73) consisting of the sensor chip (3) and optionally of a die pad (73) supporting the sensor chip (3) is arranged such that a top surface (ts) of the unit (3, 73) does not protrude from a level defined by a top surface (ts) of the contact pads (2), and a bottom surface (bs) of the unit (3,73) does not protrude from a level defined by a bottom surface (bs) of the contact pads (2).