Photoresist composition and photoresist film using the same
US10990009B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2018 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Feb 3, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2438/03
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist composition capable of forming a pattern in which a footing phenomenon is suppressed while being highly sensitive during formation of a fine pattern on a metal surface substrate, and capable of producing a photoresist film that is excellent in chemical stability, and a photoresist film using the photoresist composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.