Connection between parallel system board and power board
US10990141B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 10, 2019 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Oct 10, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electrical assembly includes a system board and a power board closely arranged with each other in a parallel relation. An electronic package and a system connector are mounted upon an upper surface of the system board. A power connector and a set of connector units are mounted on an undersurface of the power board. Another set of connector units are formed on an upper surface of the electronic package. A heat sink is positioned upon the power board and contacts the electronic package via a center opening in the power board. After assembled, the power supply is provide through connection between the two sets of the connector units and that between the system connector and the power connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.