Three-dimensional package structure
US10991681B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2020 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Feb 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The three-dimensional package structure is applicable to a POL, (Point of Load) converter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.